Beijing-based AI chip startup SUNMMIO has completed its Pre-A2 and Series A financing. The latest rounds were led by Beijing state-backed investment platforms, including Yizhuang State Investment. The company has raised nearly RMB 2 billion in total over the past year.
SUNMMIO develops 3D-stacked chips for large-model inference. It plans to use the funding to expand its R&D team, advance its technology and accelerate mass production of its proprietary 3D TokenPU processors.
Its first-generation A4E chip completed tape-out in June. The design stacks eight memory wafers above a logic wafer and provides a stated memory bandwidth of 16 terabytes per second, targeting the data-transfer bottlenecks that limit AI inference performance. [EE Times China, in Chinese]