Up and Comers Archives · TechNode

CoWoS is a high-density advanced packaging technology developed by TSMC for high-performance chips.

TSMC’s advanced packaging capacity under strain as Nvidia, AMD, and Amazon increase orders for AI chips: report

by Jessie Wu Sep 25, 2023Sep 25, 2023

The 19th Asian Games have introduced Esports as a medal event.

E-sports makes debut at the Asian Games 2023 in Hangzhou, China

by Jessie Wu Sep 21, 2023Sep 22, 2023

Honor’s “handbag” design may help it stand out in an increasingly competitive market.

Honor launches handbag-style foldable phone the V Purse

by Jessie Wu Sep 20, 2023Sep 20, 2023

TSMC is working with Broadcom and Nvidia to develop silicon photonics and co-packaged optics (CPO)

TSMC cooperates with Broadcom and Nvidia to develop advanced silicon photonics technology: report

by Jessie Wu Sep 12, 2023Sep 13, 2023

Qualcomm looks set to adopt a dual-source approach by partnering with both TSMC and Samsung for next year’s Snapdragon 8 Gen 4.

Qualcomm may source 3nm chips from TSMC and Samsung for new Snapdragon 8 Gen 4

by Jessie Wu Aug 21, 2023Aug 21, 2023

Nuverse’s Crystal of Atlan becomes ByteDance’s first mobile gaming hit

by Jessie Wu Aug 16, 2023Aug 17, 2023

new energy vehicles battery electric vehicles catl tesla lg chem byd

China’s CATL mulls bid for two lithium mines in Sichuan: report

by Jill Shen Jul 19, 2023Jul 19, 2023

assisted driving

Xpeng, Li Auto, and Huawei: Competition heats up in assisted driving

by Icebin Jul 6, 2023Jul 12, 2023

Kai-Fu Lee launches AI startup, calls large model a “historical opportunity” for China

by Cheyenne Dong Jul 5, 2023Jul 5, 2023

New energy vehicles electric vehicles EV China fisker ocean shanghai tesla

Fisker to enter China, open first delivery center in Shanghai: executive

by Jill Shen Jun 21, 2023Jun 21, 2023

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