PaXini has completed a RMB1 billion strategic funding round, bringing its cumulative fundraising to RMB3.5 billion, the company said on Aug. 3. The new round was jointly led by an unnamed global consumer electronics and semiconductor group, BOC International Investment, Kunpeng Fund and Hexin Fangce.
Other participants included Dinghui Baifu, Chengdu Jiazi AI Fund, Jingming Capital and Tianjin Rongguo Sheng, while existing investor Zhílai Capital also increased its investment. PaXini said its tactile-sensing chips shipped nearly 1 million units over the past year, with the new funds to support R&D, capacity expansion and overseas growth. [21st Century Business Herald, in Chinese]